Molex Releases Report on Thermal Management Challenges and Opportunities for I/O Modules amid Emerging Solutions for Next-Gen Data Center Cooling
- Fueled by heightened demand for the fastest data rates, optical I/O module power requirements push traditional forced-air cooling to operational limits
- Shift to 224 Gbps PAM-4 interconnects creates nearly a 4X increase in power density, increasing thermal management costs and complexities
- Advancements in server and optical module thermal management encompass advanced liquid cooling solutions and new drop down heat sink (DDHS) technology
LISLE, IL - Media OutReach Newswire - 14 June 2024 - Molex, a global electronics leader and connectivity innovator, has published a report that examines thermal management pitfalls and possibilities as data center architects and operators strive to balance high-speed data throughput requirements with the impacts of growing power density and the need for heat dissipation on critical servers and interconnect systems.
